ForLab HELIOS

Intelligent implants and sensors, novel optical signal processors and neuromorphic microchips for speech- and pattern recognition, and secure data communication and security systems have become important research and engineering areas.

The co-integration of microelectronics and photonics as enabling technology opens up new fields of application with huge potential in medical and sensor technology, or optical communication and signal processing all the way to optical computing.

Universities represent a central innovation factor in these research-intensive fields of activity. Upon the Hightech Strategy 2025 the Federal Ministry of Education and Research (BMBF) provides a total of 50 million euros for investments in microelectronic research at universities throughout Germany. Hence research at the highest international level is made possible by investing in state-of-the-art equipment and facilities at universities. Twelve “Research Laboratories Germany - ForLabs” were elected to open up new fields of research for the microelectronics of the future and train young scientists with state-of-the-art equipment. The laboratories network together and with external partners for better scientific exchange and stronger cooperation.

The Research Lab Microelectronics Hamburg for the Co-Integration of Electronics and Photonics – HELIOS – at Hamburg University of Technology (TUHH) and the University of Hamburg (UHH) are funded with 5.15 million euros for establishing the new research infrastructure.

With ForLab HELIOS a networked laboratory for optoelectronics is being created that drives the integration of electronics and photonics. This co-integration makes photonic systems electronically controllable and the light circuits can be evaluated directly on the chip. This makes many applications much faster and more energy efficient. The investments are planned along the entire development process: from design and modeling, fabrication, integration and encapsulation to testing, characterization and feedback of the results into the design flow. Figure 1 summarizes the holistic research environment and strategy of ForLab HELIOS.

The HELIOS project can be briefly summarized as follows

Objectives:

  • HELIOS aims novel Co-Integration concepts of two key technologies Electronics & Photonics.
  • Combining and strengthening the research impact of the Hamburg University of Technology and the University of Hamburg for photonic - electronic integrated systems.

Technological Challenges:

  • Microelectronic and photonic domains are still considered too isolated in order to explore the benefits of these complementary technologies.
  • Matching the process sequences and value chain in design and simulation, manufacturing, system testing, and packaging of co-integrated photonic-electronic integrated circuits remains a challenge

Description of the Project:

  • Strategic investments in state-of-art nanotechnology processing machines and laboratory equipment will strengthen the project partners along the entire development cycle of novel integrated optoelectronic systems.
  • Define mutual System-on-Chip approaches for photonics and electronics to minimize development times for interdisciplinary research areas.
  • Reduce timescales and enhance maturity of component design, fabrication, testing & packaging.
  • Creating an infrastructure with outstanding profile focus on measurement, sensor and medical technology as well as optical signal processing and computing.
  • Establishing an interdisciplinary nucleus for research and teaching in optoelectronic systems

In the future, innovations can thus be implemented more quickly in prototypes and costs and development times for new types of optoelectronic applications can be drastically reduced. This will significantly advance the location Hamburg for research, development and use of photonic-electronically integrated systems.

Funding: 

The project is granted by „Forschungslabore Mikroelektronik Deutschland (ForLab)“ from Federal Ministry of Education and Research (BMBF) in the Federal Government's Framework Programme for Research and Innovation „Mikroelektronik aus Deutschland – Innovationstreiber der Digitalisierung“.

 

Contact: Dr.-Ing. Timo Lipka