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IEET > Staff > Senior Scientist > Dr.-Ing. Payam Teimourzadeh Baboli

Dr.-Ing. Payam Teimourzadeh Baboli

Senior Scientist

Contact

Dr.-Ing. Payam Teimourzadeh Baboli
E-6 Elektrische Energietechnik
  • Elektrische Energietechnik
Harburger Schloßstraße 22a,
21079 Hamburg
Building Harburger Schloßstraße 22a, Room 2.001
Phone: +49 40 42878 3013
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CV

Work experience

Since Jan. 2024

Senior Scientist and Lecturer, Hamburg University of Technology (TUHH), Germany
Aug. 2019 – Dec.2023

Post-Doc, Senior Researcher and Project Manager, OFFIS – Institute for Information Technology, Oldenburg, Germany
Feb. 2015 – Jul. 2019

Assistant Professor in Electrical Engineering, University of Mazandaran (UMZ), Babolsar, Iran

Mar. 2007 – Jan. 2015

 

 

Iranian Power System Engineering Research Center (IPSERC), Tehran, Iran

  • Senior Researcher and Project Manager (Apr. 2014 – Jan. 2015, Full-time)
  • Researcher and Lab. Engineer (Mar. 2007 – Apr. 2014, Part-time)

 

Research Projects

KoLa
Optimized Load Management and Flexibility Coordination for Electrified Urban Public Transport

KoLa

Optimized Load Management and Flexibility Coordination for Electrified Urban Public Transport

Federal Ministry for Economic Affairs and Climate Action (BMWK); Duration: 2022 to 2026

to the project page
DISEGO
Critical Components for Distributed and Secure Grid Operation

DISEGO

Critical Components for Distributed and Secure Grid Operation

Federal Ministry for Economic Affairs and Climate Action (BMWK); Duration: 2022 to 2025

to the project page
EffiziEntEE
Efficient integration of high shares of renewable energies in technically and economically integrated energy systems

EffiziEntEE

Efficient integration of high shares of renewable energies in technically and economically integrated energy systems

Federal Ministry for Economic Affairs and Climate Action (BMWK); Duration: 2022 to 2025

to the project page
iNeP
Integrated network planning for the electricity, gas and heat sectors

iNeP

Integrated network planning for the electricity, gas and heat sectors

Federal Ministry for Economic Affairs and Climate Action (BMWK); Duration: 2021 to 2026

to the project page
VeN²uS
Networked grid protection systems - Adaptive and interconnected

VeN²uS

Networked grid protection systems - Adaptive and interconnected

Federal Ministry for Economic Affairs and Climate Action (BMWK); Duration: 2021 to 2024

to the project page
DisrupSys
Disruptive functions and technology for angle-based integrated grid operation in converter-dominated power systems with predominantly renewable energy supply

DisrupSys

Disruptive functions and technology for angle-based integrated grid operation in converter-dominated power systems with predominantly renewable energy supply

Federal Ministry for Economic Affairs and Climate Action (BMWK); Duration: 2021 to 2024

to the project page

Publications

TUHH Open Research (TORE)

2023

2022

2021

2020

Courses

Stud.IP
link to course in Stud.IP Studip_icon
Microsystems Technology (PBL)
Subtitle:
This course is part of the module: Microsystems Technology in Theory and Practice
Semester:
WiSe 23/24
Course type:
PBL -Projekt-/problembasierte Lehrveranstaltung (Lehre)
Course number:
lv725_w23
Lecturer:
Prof. Dr. Hoc Khiem Trieu
Description:
  • Introduction (historical view, scientific and economic relevance, scaling laws)
  • Semiconductor Technology Basics, Lithography (wafer fabrication, photolithography, improving resolution, next-generation lithography, nano-imprinting, molecular imprinting)
  • Deposition Techniques (thermal oxidation, epitaxy, electroplating, PVD techniques: evaporation and sputtering; CVD techniques: APCVD, LPCVD, PECVD and LECVD; screen printing)
  • Etching and Bulk Micromachining (definitions, wet chemical etching, isotropic etch with HNA, electrochemical etching, anisotropic etching with KOH/TMAH: theory, corner undercutting, measures for compensation and etch-stop techniques; plasma processes, dry etching: back sputtering, plasma etching, RIE, Bosch process, cryo process, XeF2 etching)
  • Surface Micromachining and alternative Techniques (sacrificial etching, film stress, stiction: theory and counter measures; Origami microstructures, Epi-Poly, porous silicon, SOI, SCREAM process, LIGA, SU8, rapid prototyping)
  • Thermal and Radiation Sensors (temperature measurement, self-generating sensors: Seebeck effect and thermopile; modulating sensors: thermo resistor, Pt-100, spreading resistance sensor, pn junction, NTC and PTC; thermal anemometer, mass flow sensor, photometry, radiometry, IR sensor: thermopile and bolometer)
  • Mechanical Sensors (strain based and stress based principle, capacitive readout, piezoresistivity,  pressure sensor: piezoresistive, capacitive and fabrication process; accelerometer: piezoresistive, piezoelectric and capacitive; angular rate sensor: operating principle and fabrication process)
  • Magnetic Sensors (galvanomagnetic sensors: spinning current Hall sensor and magneto-transistor; magnetoresistive sensors: magneto resistance, AMR and GMR, fluxgate magnetometer)
  • Chemical and Bio Sensors (thermal gas sensors: pellistor and thermal conductivity sensor; metal oxide semiconductor gas sensor, organic semiconductor gas sensor, Lambda probe, MOSFET gas sensor, pH-FET, SAW sensor, principle of biosensor, Clark electrode, enzyme electrode, DNA chip)
  • Micro Actuators, Microfluidics and TAS (drives: thermal, electrostatic, piezo electric and electromagnetic; light modulators, DMD, adaptive optics, microscanner, microvalves: passive and active, micropumps, valveless micropump, electrokinetic micropumps, micromixer, filter, inkjet printhead, microdispenser, microfluidic switching elements, microreactor, lab-on-a-chip, microanalytics)
  • MEMS in medical Engineering (wireless energy and data transmission, smart pill, implantable drug delivery system, stimulators: microelectrodes, cochlear and retinal implant; implantable pressure sensors, intelligent osteosynthesis, implant for spinal cord regeneration)
  • Design, Simulation, Test (development and design flows, bottom-up approach, top-down approach, testability, modelling: multiphysics, FEM and equivalent circuit simulation; reliability test, physics-of-failure, Arrhenius equation, bath-tub relationship)
  • System Integration (monolithic and hybrid integration, assembly and packaging, dicing, electrical contact: wire bonding, TAB and flip chip bonding; packages, chip-on-board, wafer-level-package, 3D integration, wafer bonding: anodic bonding and silicon fusion bonding; micro electroplating, 3D-MID)
Performance accreditation:
620 - Microsystems Technology in Theory and Practice<ul><li>620 - Microsystems Technology in Theory and Practice: mündlich</li></ul><br>621 - Microsystems Technology in Theory and Practice<ul><li>620 - Microsystems Technology in Theory and Practice: mündlich</li><li>820 - Microsystems Technology in Theory and Practice - Practical Coursework: Subject theoretical and practical work</li></ul>
ECTS credit points:
2
Stud.IP informationen about this course:
Home institute: Institut für Mikrosystemtechnik (E-7)
Registered participants in Stud.IP: 1
TU Hamburg
Institute of Electrical Power and Energy Technology (ieet) E-6
Prof. Dr.-Ing. Christian Becker
Harburger Schloßstraße 36
21079 Hamburg
E-mail : ieet(at)tuhh.de
Phone : +49 40 42878 3213
Fax : +49 40 42878 2382
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