Call for contributions

We invite empirical, theoretical, methodological, and practical contributions addressing topics in logistics and supply chain management related to one of the following tracks:

Logistics Management and Operations, e.g.

• Urban Logistics and Last-Mile Delivery
• Maritime Logistics and Port Operations
• Multi-Modal Transportation Networks
• Competences and Organizational Structures in Logistics Systems
• Innovation, Leadership and Teams in Logistics Systems

Advanced Logistics Technologies, e.g.

• Advanced Manufacturing and Material Flow Systems
• Digitals Twins and Simulation of Logistics Systems
• Artificial Intelligence and Business Analytics
• Digital Logistics Platforms
• Case Studies and Best Practices

Sustainability and Resilience, e.g.

• Climate-Resilient Transportation Systems
• Logistics Systems for the Circular Economy
• Social and Environmental Responsibility in Supply Chains
• Sustainability and Resilience Assessment
• Supply Chain Risk Management

All authors seeking to present their work at HICL 2024, are invited to submit an abstract of 300 to 500 words. All accepted abstracts will be published in the conference booklet.

Guidelines

• Abstracts must be written in English.
• Length is limited to 500 words.
• Please assign your abstract to one of the above tracks.

Important dates

• 01.04.24 - Abstract submission opens
• 31.05.24 21.06.24 - Abstract submission closes
• June 2024 - Acceptance notification

In contrast to previous HICL conferences, there will be no conference proceedings with full papers this year. Instead, the conference organizers are guest editing a special issue in the International Journal of Physical Distribution & Logistics Management (IJPDLM) that is closely related to the conference theme. Authors interested in submitting a full paper are invited to participate in a paper development workshop at the HICL conference where the guest editors will be available to discuss this call’s themes in depth and to provide guidance on aligning the working papers better with the special issue.