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IEET > Staff > Research Assistants > Béla Wiegel, M.Sc.

Béla Wiegel

M.Sc.
Research Assistant

Contact

Béla Wiegel, M. Sc.
E-6 Elektrische Energietechnik
  • Elektrische Energietechnik
Office Hours
Auf Anfrage
Harburger Schloßstraße 22a,
21079 Hamburg
Building HS22a, Room 2.003
Phone: +49 40 42878 2240
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Research Projects

EffiziEntEE
Efficient integration of high shares of renewable energies in technically and economically integrated energy systems

EffiziEntEE

Efficient integration of high shares of renewable energies in technically and economically integrated energy systems

Federal Ministry for Economic Affairs and Climate Action (BMWK); Duration: 2022 to 2025

to the project page
CyEntEE
I³-Lab Cyber Physical Energy Systems – Sustainability, Resilience and Economics

I³-Lab

CyEntEE

Cyber Physical Energy Systems – Sustainability, Resilience and Economics

Hamburg University of Technology (TUHH); Duration: 2020 to 2023

to the project page

Publications

TUHH Open Research (TORE)

2024

2023

2022

2021

Courses

Stud.IP
link to course in Stud.IP Studip_icon
Microsystems Technology (PBL)
Subtitle:
This course is part of the module: Microsystems Technology in Theory and Practice
Semester:
WiSe 23/24
Course type:
PBL -Projekt-/problembasierte Lehrveranstaltung (Lehre)
Course number:
lv725_w23
Lecturer:
Prof. Dr. Hoc Khiem Trieu
Description:
  • Introduction (historical view, scientific and economic relevance, scaling laws)
  • Semiconductor Technology Basics, Lithography (wafer fabrication, photolithography, improving resolution, next-generation lithography, nano-imprinting, molecular imprinting)
  • Deposition Techniques (thermal oxidation, epitaxy, electroplating, PVD techniques: evaporation and sputtering; CVD techniques: APCVD, LPCVD, PECVD and LECVD; screen printing)
  • Etching and Bulk Micromachining (definitions, wet chemical etching, isotropic etch with HNA, electrochemical etching, anisotropic etching with KOH/TMAH: theory, corner undercutting, measures for compensation and etch-stop techniques; plasma processes, dry etching: back sputtering, plasma etching, RIE, Bosch process, cryo process, XeF2 etching)
  • Surface Micromachining and alternative Techniques (sacrificial etching, film stress, stiction: theory and counter measures; Origami microstructures, Epi-Poly, porous silicon, SOI, SCREAM process, LIGA, SU8, rapid prototyping)
  • Thermal and Radiation Sensors (temperature measurement, self-generating sensors: Seebeck effect and thermopile; modulating sensors: thermo resistor, Pt-100, spreading resistance sensor, pn junction, NTC and PTC; thermal anemometer, mass flow sensor, photometry, radiometry, IR sensor: thermopile and bolometer)
  • Mechanical Sensors (strain based and stress based principle, capacitive readout, piezoresistivity,  pressure sensor: piezoresistive, capacitive and fabrication process; accelerometer: piezoresistive, piezoelectric and capacitive; angular rate sensor: operating principle and fabrication process)
  • Magnetic Sensors (galvanomagnetic sensors: spinning current Hall sensor and magneto-transistor; magnetoresistive sensors: magneto resistance, AMR and GMR, fluxgate magnetometer)
  • Chemical and Bio Sensors (thermal gas sensors: pellistor and thermal conductivity sensor; metal oxide semiconductor gas sensor, organic semiconductor gas sensor, Lambda probe, MOSFET gas sensor, pH-FET, SAW sensor, principle of biosensor, Clark electrode, enzyme electrode, DNA chip)
  • Micro Actuators, Microfluidics and TAS (drives: thermal, electrostatic, piezo electric and electromagnetic; light modulators, DMD, adaptive optics, microscanner, microvalves: passive and active, micropumps, valveless micropump, electrokinetic micropumps, micromixer, filter, inkjet printhead, microdispenser, microfluidic switching elements, microreactor, lab-on-a-chip, microanalytics)
  • MEMS in medical Engineering (wireless energy and data transmission, smart pill, implantable drug delivery system, stimulators: microelectrodes, cochlear and retinal implant; implantable pressure sensors, intelligent osteosynthesis, implant for spinal cord regeneration)
  • Design, Simulation, Test (development and design flows, bottom-up approach, top-down approach, testability, modelling: multiphysics, FEM and equivalent circuit simulation; reliability test, physics-of-failure, Arrhenius equation, bath-tub relationship)
  • System Integration (monolithic and hybrid integration, assembly and packaging, dicing, electrical contact: wire bonding, TAB and flip chip bonding; packages, chip-on-board, wafer-level-package, 3D integration, wafer bonding: anodic bonding and silicon fusion bonding; micro electroplating, 3D-MID)
Performance accreditation:
620 - Microsystems Technology in Theory and Practice<ul><li>620 - Microsystems Technology in Theory and Practice: mündlich</li></ul><br>621 - Microsystems Technology in Theory and Practice<ul><li>620 - Microsystems Technology in Theory and Practice: mündlich</li><li>820 - Microsystems Technology in Theory and Practice - Practical Coursework: Subject theoretical and practical work</li></ul>
ECTS credit points:
2
Stud.IP informationen about this course:
Home institute: Institut für Mikrosystemtechnik (E-7)
Registered participants in Stud.IP: 1

Supervised Theses

ongoing
completed

2024

  • Rücker, J. (2024). Optimal Scheduling of Flexible Components in Residential Neighborhoods Using Detailed Linear Programming.

2023

  • Nitz, A. (2023). Die Wärmepumpen im virtuellen Kraftwerk - Untersuchung von Wärmepumpen unter Berücksichtigung unterschiedlicher Funktionsprotokolle innerhalb eines virtuellen Kraftwerks.

2022

  • Kaya, E. (2022). Simulation des Lebenszyklus‘ einer Lithium Ion Zelle in den stationären EP and instationären EV Anwendungsfällen.

  • Pauelsen, F.-T. (2022). Implementierung eines Maximum-Power-Point-Tracker für Photovoltaikanlagen in Modelica.

  • Rücker, J. (2022). Dynamische Untersuchung des Verhaltens elektrischer Komponenten auf Quartiersebene hinsichtlich der Spannungshaltung.

  • Rüffert, J. (2022). Charakterisierung von Zellen in Verteilnetzen anhand von Bewertungskriterien und die Auswirkungen von punktuell und zeitlich begrenzt auftretenden Lasten.

2021

  • Helmrich von Elgott, L. (2021). Optimierter Einsatz dezentraler Flexibilität zur Betriebsführung intelligenter sektorgekoppelter Verteilnetze.

  • Zwinzscher, S. (2021). Entwicklung einer Methodik zur dynamischen Berechnung der Flexibilität eines auf Power-to-Heat basierenden Nahwärmenetzes.

TU Hamburg
Institute of Electrical Power and Energy Technology (ieet) E-6
Prof. Dr.-Ing. Christian Becker
Harburger Schloßstraße 22a
21079 Hamburg
E-mail : ieet(at)tuhh.de
Phone : +49 40 42878 3213
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